Institutional Assessment and Research

CSUMB Experience Survey 2022

Every three years, all degree-seeking undergraduate students are invited to complete the CSUMB Experience Survey.

As this is the final week for the survey, we will be having a drawing for one of two $50 Amazon gift cards and a grand prize drawing for one of two $100 Amazon gift cards. The drawings will occur on Friday, May 6, 2022 at 2:00 PM. Be sure to complete the survey by then for your chance to be entered into the drawings. All students that have completed the survey are eligible for the weekly drawings.

Check your email for your invitation to participate. (See email sent on Tuesday, May 3, 2022 with the subject “FINAL Chance: Help Improve CSUMB and Get a Chance to Win a $50 or $100 Prize”)

The survey requires just 10-15 minutes of your time. Completing this survey is an opportunity for you to tell faculty, staff, and administrators about your experience with various aspects of CSUMB. Your responses will be used to help make necessary improvements to the academic and non-academic offerings of CSUMB. 

Note that your responses to all of the questions will remain confidential.

If you did not receive an invitation to participate but would like to be entered into the drawing, send a letter via inter-campus mail to Institutional Assessment and Research.

CSUMB’s faculty, staff, and administrators appreciate you completing the survey so that we can make CSUMB an even better place for all students.

Utilization of past CSUMB experience survey findings

Students’ responses from previous CSUMB Experience Surveys have led to many improvements in academic and non-academic offerings, including the following:

  • Easier path to completing requirements for your major
  • Improving academic advising
  • Your First Year Seminar earns General Education credits
  • Easier path to completing General Education requirements

Results from prior survey

Contact for more information

If you have any questions regarding the survey, contact Institutional Assessment and Research at